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13. Storage Conditions

Description

Min

Max

Unit

Maximum storage time above 80C

0

500

h

Maximum long term storage temperature

-40

80

C

Long term storage humidity*

0

45

%

Number of reflow cycles**

0

1

 

Maximum reflow temperature

0

260

C

Recommended dry bake temperature*

105

125

C

Recommended dry bake time*

6

48

h

* If storage humidity is exceeded it is recommended to dry bake the component prior to soldering.

** due to the small pad pitch, standard reflow process may need to be adjusted to achieve reliable solder result.

 

 

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